PVD (Physical Vapor Deposition): Vacuum evaporation is a technique in which the target material of the plating material is heated and evaporated under vacuum conditions, causing a large number of atoms and molecules to vaporize and leave the liquid plating material or the solid plating material surface (or sublimation), and ultimately deposit on the substrate surface. Throughout the process, gaseous atoms and molecules will undergo minimal collisions in vacuum and directly migrate to the substrate, depositing on the surface of the substrate to form a thin film. The methods of evaporation include resistance heating, high-frequency induction heating, electron beam, laser beam, ion beam high-energy bombardment of the plating material, etc.
